Microchip Technology - FPGA available in engineering silicon and headed for space qualification | Heisener Electronics
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Microchip Technology - FPGA available in engineering silicon and headed for space qualification

Technology Cover
Fecha de Publicación: 2021-03-01, Microchip Technology

Microchip Technology has delivered engineering silicon for its RT PolarFire FPGA, and the device has passed the certification of aerospace component reliability standards. Now, designers can produce hardware prototypes with the same electrical and mechanical properties as electrical. These electrical and mechanical properties and RT PolarFire FPGAs with space technology qualifications will have high industrial low power consumption and the ability to withstand space radiation effects. The bandwidth provided by the on-orbit processing system is the same.

Bruce Weyer, vice president of Microchip's FPGA business unit, said: "This is an important milestone because we released the RT PolarFire FPGA engineering chip to our customers and started the aerospace certification process through the complete QML Class V standard." "Many of our customers We have begun to use our commercial PolarFire MPF500T FPGA to start the development of satellite system payloads. Now all prototyping can be done through silicon. The form, suitability and function of silicon are the same as the RT PolarFire FPGA that we finally passed on the fly."

The company is conducting Mil-Std 883 B, QML Q and QML V certifications for its RT PolarFire RTPF500T FPGA-the highest certification and shielding standard for space monolithic integrated circuits. FPGA was developed to survive rocket launches and meet the demanding performance requirements in space. It is ideal for the following applications: high-resolution passive and active imaging, precise remote scientific measurement, multispectral and hyperspectral imaging, and the use of neural networks Perform object detection and recognition network. These applications require high levels of operating performance and density, low heat dissipation, low power consumption and low system-level costs.

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