Explore the new edition of the Immersive Technology series | Heisener Electronics
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Explore the new edition of the Immersive Technology series

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Fecha de Publicación: 2022-05-15, Newava Technology Inc.

      Mouser introduces the next installment in its award-winning series of licensed innovations. Chapter 2 delves into the huge potential of immersive technology and XR, which combines elements of AR, VR, and 360-degree spatial audio. Offering a variety of exclusive content - including a new Then, Now and Next video, articles, infographics, and a new episode of the Tech Between Us podcast - the company provides an in-depth look at how extended and immersive technology is playing a role in our physical The world builds new experiences.

     Glenn Smith, Mouser President and CEO said: "With the development of the Internet of Things, smart devices and 5G, the world around us has evolved from a purely physical world to a balance of real, immersive and extended reality," "We are delighted The latest episode of Mouser's EIT series highlights immersive technologies and focuses on how they can benefit many industries, from consumer to enterprise. "

      Hosting the company's new episode of tech podcast between Raymond Yin and Us features Mark Saint, executive director of ar for Enterprise Alliance, in a Riveting talk highlighting the growing role of these technologies and the problems they're solving in business units around the world.

     Sach said: "immersive technology is becoming more and more mainstream, they provide the advantage of exciting." "I'm excited to talk with Raymond about these technologies that are changing the way we interact with our environment and the people around us."

     In the podcast, the second part of the series shares an insightful analysis of the technology landscape, detailing its origins and what the future might look like. Immersive technology content is sponsored by the company's renowned manufacturers Amphenol Communications Solutions, Analog Devices, Intel, Microchip technology and TDK.

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