Toshiba's TCK42xG gate driver family of solutions addresses various challenges in power multiplexing. The TCK421G is the first product in the series and is designed specifically for 20 V lines.
TDK has introduced the new B32354S* series of AC filter capacitors, adding to its EPCOS metallized polypropylene film (MKP) capacitor portfolio for AC filter applications. Capacitors are 4-pin design with 52.5 mm pin spacing, rated for 275 VAC or 350 VAC, capacitors range from 10 μF to 40 μF, and maximum operating temperature 85 °C.
Bourns launches new POWrFuse high-power fuse series. The Bourns POWrFuse PF-K series is ISO 8820-8 compliant and is designed to protect high-voltage accessory circuits in electric vehicles (EVs) and hybrid electric vehicles (HEVs). These circuits are found in a variety of EV/HEV applications, including power storage (ESS), battery disconnect units (BDU), and battery management systems (BMS).
Kingston has released a new entry-level PCIe 4.0 series of NV2 series with master control upgrades. The NV2 series uses the standard M.2 2280 form factor. Although it may not be able to fully utilize the theoretical bandwidth of PCIe 4.0 x4, the sequential read and write performance of 3000 and 1300 MB/s can still meet the needs of ordinary consumers.
Apex Microtechnology's silicon carbide-based switch modules integrate gate drivers in a small hybrid package, and the SA110 high-current, high-voltage half-h-bridge switch module uses silicon carbide (SiC) mosfet integrated gate drivers. The SA110 integrates gate drive control, a very high 400 kHz maximum switching frequency, and 28 A continuous output current in the Class A variant.
KEMET R76H series is made of polypropylene film and bimetallized polyester film as electrodes with tin radial leads. The radial leads are welded to the metal layer at the end of the capacitor windings. The capacitor is enclosed in a self-extinguishing solvent-resistant plastic case using a thermosetting resin material that meets UL 94 V-0 requirements. According to the different voltage parameters, two different winding structures are used.
Littelfuse's commercial vehicle product line offers a wide range of relays suitable for many vehicles on the market. The 40A and 70A relays are offered in SPST(form A) or SPDT(form C) configurations, with many other options to meet design requirements such as resistors and diodes built into the relay circuit for added protection. The 0.250 "Quick connection (QC) blade contact terminals are silver alloy to resist corrosion in the vehicle's harsh environment (such as under the hood).
IXYS '1000 V superjunction X-class HiPerFET Power MOSFET power semiconductor line, now part of Littelfuse, is optimized for soft switching power conversion applications. Well-suited applications include efficient, high-power density applications such as resonant mode power supplies, AC and DC motor drivers, DC-DC converters, robot and servo controls, smart meters, renewable energy inverters, welding inverters, and battery chargers.
Vishay Intertechnology, Inc. has announced the availability of two new commercial 1107 package IHDM edging-wound plug-in inductors, IHDM-1107BBEV-20 and IHDM-1107BBEV-30, with A soft saturation current of 422 A. In the strict operating temperature range of -55 °C to +180 °C, it has excellent stability of sensing value and saturation current, low power consumption and excellent heat dissipation performance.
Nichicon Corporation has developed and launched the GYF series of large-capacity conductive polymer hybrid aluminum electrolytic capacitors with high ripple current and excellent low ESR performance, which are in high demand in the automotive and communication fields.
Smiths Interconnect, the world's leading supplier of semiconductor test solutions, announced the expansion of its DaVinci high-speed test family with the introduction of the DaVinci Micro Test Socket, which is designed for high-speed testing with a minimum pitch of 0.35mm.
Molex has announced the launch of its first pluggable module solution for co-packaged optical components (CPO). The NEW External Laser Source InterCONNECT SYSTEM (ELSIS) IS A complete SYSTEM WITH housing, optical and electrical connectors and pluggable modules, using proven technology to accelerate the development of very large scale data centers.
Teledyne FLIR is at the forefront of the effort to prioritise data protection and build reliable security solutions. For government bodies, security integrators, and mission-critical customers looking to retrofit their surveillance systems with NDAA-compliant cameras, the company’s suite of industry-leading multispectral fixed cameras, bullet cameras, pan-tilt-zoom cameras, and dome cameras provide purpose-built solutions for all applications.
Review Display Systems introduces a new range of high-performance and small-size TFT display modules. Available in various sizes and resolutions including 1.4" (240 x 240 pixels), 1.77" (128 x 160 pixels), 2.4" QVGA (240 x 320 pixels), 2.8" QVGA (240 x 320 pixels), 3.5" HVGA (320 x 480 pixels), and 4.3" WQVGA (480 x 272 pixels).
PPM Power offers the TTPi UltraMod family of GaN-based, multipurpose, bi-directional, isolated, DC-DC converters, designed to work either standalone or together in a multi-modular system.
Holtek has launched two new Low Power MCU series with A/D function Flash MCU HT66L2540A/HT66L2550A and LCD driver HT67L2540A/HT67L2550A. The new built-in LIRC and LXT with high precision and low current, as well as the flexible conversion design of four MIRC segments to reduce the conversion current of 10/12-bit SAR ADC, are very suitable for a variety of power saving products.
Renesas Electronics announced that the R9A02G020, the industry's first RISC-V MCU optimized for advanced motor control systems, enables users to benefit from a ready-to-use turnkey solution for motor control applications without investing in development costs. With pre-programmed ASSPs, users can reduce time-to-market and costs, saving RISC-V-related tools and software investments. Target applications for the new solutions include home/building automation, healthcare equipment, home appliances, drones, and more.
The Texas Instruments CC2564MODx module is a complete Bluetooth BR/EDR and low-energy HCI solution that reduces design effort, cost, and time-to-market. The CC2564MODx module includes the 7th generation core of TI and provides a versatile, product-proven solution compatible with Bluetooth 4.1. These modules are FCC-certified, IC and CE certified, and no prior RF experience is required to develop these devices.
