Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FPGA 512K CONFIG MEM 20SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias4.640 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC FLASH CONFIG 8M 20PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias6.992 |
|
8Mb | 2.97 V ~ 3.63 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M LV 8DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias3.968 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFG EEPROM 4M LV 44PLCC
|
Paquete: 44-LCC (J-Lead) |
En existencias20.208 |
|
4Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 8DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias5.056 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 44-PLCC
|
Paquete: 44-LCC (J-Lead) |
En existencias3.072 |
|
4Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 44PLCC
|
Paquete: 44-LCC (J-Lead) |
En existencias4.304 |
|
2Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias2.288 |
|
256Kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-PLCC
|
Paquete: 44-LCC (J-Lead) |
En existencias6.304 |
|
8Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 5V 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias3.472 |
|
400kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 5V 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias5.504 |
|
200kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 10K 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias126.300 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SER 100000 I-TEMP 20SOIC
|
Paquete: 20-SOIC (0.295", 7.50mm Width) |
En existencias4.960 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC 3V PROM PROG 50K 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias5.408 |
|
50kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias5.136 |
|
50kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias5.232 |
|
50kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SERIAL CONFIG PROM 2M 20PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias3.536 |
|
2Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 65K 8-SOIC
|
Paquete: 8-SOIC (0.154", 3.90mm Width) |
En existencias2.100 |
|
65kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Altera |
IC CONFIG DEVICE 212KBIT 20PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias7.792 |
|
212kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 212KBIT 20PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias48.276 |
|
212kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 32TQFP
|
Paquete: 32-TQFP |
En existencias5.792 |
|
440kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | 32-TQFP | 32-TQFP (7x7) |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 1M 20-PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias4.256 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC QUAD-SERIAL LOW VOLTAGE CONFI
|
Paquete: 24-LBGA |
En existencias6.420 |
|
1GB | 1.7 V ~ 2 V | -40°C ~ 85°C | 24-LBGA | 24-FBGA (6x8) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8-DIP
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias18.018 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE
|
Paquete: 8-DIP (0.300", 7.62mm) |
En existencias4.000 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE
|
Paquete: 88-LFBGA |
En existencias2.912 |
|
16Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 88-LFBGA | 88-UBGA (11x8) |
||
Intel |
IC CONFIG DEVICE 128MBIT 16SOIC
|
Paquete: 16-SOIC (0.295", 7.50mm Width) |
En existencias5.408 |
|
128Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Intel |
IC CONFIG DEVICE 16MBIT 100QFP
|
Paquete: 100-BQFP |
En existencias12.480 |
|
16Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 64MBIT 16SOIC
|
Paquete: 16-SOIC (0.295", 7.50mm Width) |
En existencias8.604 |
|
64Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Altera |
CONFIG MEMORY, 64KX1, SERIAL
|
Paquete: - |
Request a Quote |
|
64kb | 3V ~ 3.6V | 0°C ~ 70°C (TA) | 32-TQFP | 32-TQFP (7x7) |