Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC RING GENERATOR 16SOIC
|
Paquete: 16-SOIC (0.295", 7.50mm Width) |
En existencias5.056 |
|
- | 1 | 15 V ~ 110 V | 1.9mA | - | - | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SO |
||
Microsemi Corporation |
IC VOICEPORT FXS 4KHZ 44LQFP
|
Paquete: 44-LQFP |
En existencias360.000 |
|
PCM | 1 | 3V, 5V | - | - | - | Surface Mount | 44-LQFP | 44-eLQFP |
||
Microsemi Corporation |
IC VOICE ECHO CANCEL 208LBGA
|
Paquete: 208-LBGA |
En existencias7.840 |
|
- | 1 | 1.6 V ~ 2 V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CHIPLE 28SOIC
|
Paquete: 28-SOIC (0.295", 7.50mm Width) |
En existencias4.800 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Microsemi Corporation |
IC LINE CARD LCAS 1CH 16SOIC
|
Paquete: 16-SOIC (0.295", 7.50mm Width) |
En existencias63.864 |
|
- | 1 | 4.5 V ~ 5.5 V | - | - | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC VOIP ATA ASSP 128QFP
|
Paquete: 128-BFQFP |
En existencias4.816 |
|
PCM | 1 | 1.2V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 128-BFQFP | 128-PQFP (14x20) |
||
Rohm Semiconductor |
IC PULSE/TONE DIALER SOP24 TR
|
Paquete: 24-SOIC (0.209", 5.30mm Width) |
En existencias29.904 |
|
- | 1 | 2.5 V ~ 5.5 V | 660µA | 550mW | -10°C ~ 60°C | Surface Mount | 24-SOIC (0.209", 5.30mm Width) | 24-SOP |
||
Silicon Labs |
IC PROSLIC LINE FEED 125V 48TQFP
|
Paquete: 48-TQFP |
En existencias2.544 |
|
GCI, PCM, SPI | 4 | 3.3V | - | - | - | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Texas Instruments |
IC TXRX INTERFACE DEVICE 20-PLCC
|
Paquete: 20-LCC (J-Lead) |
En existencias17.196 |
|
ISDN | - | 4.75 V ~ 5.25 V | - | - | - | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 12CH 420TBGA
|
Paquete: 420-LBGA Exposed Pad |
En existencias3.072 |
|
LIU | 12 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 420-LBGA Exposed Pad | 420-TBGA (35x35) |
||
Maxim Integrated |
IC LIU QUAD E1/T1 144-BGA
|
Paquete: 144-BGA |
En existencias6.240 |
|
- | 4 | 3.135 V ~ 3.465 V | 320mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA | 144-TEPBGA (17x17) |
||
Texas Instruments |
IC RES RING GEN CTRLR 16DIP
|
Paquete: 16-DIP (0.300", 7.62mm) |
En existencias2.784 |
|
- | 1 | 12V | 500µA | - | -40°C ~ 125°C | Through Hole | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Texas Instruments |
IC 1 LINE RING GEN CTRLR 16SOIC
|
Paquete: 16-SOIC (0.154", 3.90mm Width) |
En existencias6.992 |
|
- | 1 | 12V | 1mA | - | -55°C ~ 125°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Cypress Semiconductor Corp |
IC TXRX HOTLINK II QUAD 256LBGA
|
Paquete: 256-LBGA Exposed Pad |
En existencias7.728 |
|
LVTTL | 4 | 3.135 V ~ 3.465 V | 900mA | - | -40°C ~ 85°C | Surface Mount | 256-LBGA Exposed Pad | 256-BGA |
||
Silicon Labs |
IC SLIC/CODEC 1CH 38TSSOP
|
Paquete: 38-TFSOP (0.173", 4.40mm Width) |
En existencias57.864 |
|
GCI, PCM, SPI | 1 | 3.13 V ~ 5.25 V | 88mA | 700mW | 0°C ~ 70°C | Surface Mount | 38-TFSOP (0.173", 4.40mm Width) | 38-TSSOP |
||
Microsemi Corporation |
IC DIGITAL SWITCH 16K CH 256LQFP
|
Paquete: 256-LQFP |
En existencias3.424 |
|
- | 1 | 1.71 V ~ 1.89 V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 256X256 44PLCC
|
Paquete: 44-LCC (J-Lead) |
En existencias6.528 |
|
- | 1 | 3 V ~ 3.6 V | 4mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.51x16.51) |
||
Intersil |
IC XDSL LINE DVR DUAL-PORT 24QFN
|
Paquete: 24-VFQFN Exposed Pad |
En existencias4.544 |
|
Serial | 2 | 10 V ~ 14.7 V | 19.5mA | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microsemi Solutions Sdn Bhd. |
10 PORT MANAGED LAYER 2-SWITCH
|
Paquete: - |
En existencias10.776 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 672-BGA |
||
Broadcom Limited |
SWITCH FABRIC
|
Paquete: - |
En existencias3.728 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
SONET/SDH TRANSPORT FRAMER/AGGRE
|
Paquete: 1292-BGA, FCBGA |
En existencias4.912 |
|
SFI-4 | - | 1.2V | - | - | - | Surface Mount | 1292-BGA, FCBGA | 1292-FCBGA |
||
Microchip Technology |
SINGLE 10G (R)XAUI PHY WITH PREM
|
Paquete: - |
En existencias7.728 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
LOW COST VDSL
|
Paquete: - |
En existencias14.448 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
Paquete: - |
En existencias3.168 |
|
- | - | - | - | - | - | - | - | - |
||
Broadcom Limited |
MULTI LAYER SWITCH--1588 ENABLED
|
Paquete: - |
En existencias7.472 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC TXRX DTMF 3V 24SSOP
|
Paquete: 24-SSOP (0.209", 5.30mm Width) |
En existencias3.280 |
|
- | 1 | 2.7V ~ 3.6V | 3.1mA | - | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microchip Technology |
IC CESOP PROC 256CH 552BGA
|
Paquete: 552-BGA |
En existencias5.520 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
||
Microchip Technology |
IC CESOP PROCESSOR 32CH 324BGA
|
Paquete: 324-BGA |
En existencias5.200 |
|
TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
||
Microchip Technology |
IC TDM SWITCH 2K-CH ENH 256LQFP
|
Paquete: 256-LQFP |
En existencias2.128 |
|
- | 1 | 1.71V ~ 1.89V | 165mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
||
Microchip Technology |
IC TDM SWITCH 512CH 160LQFP
|
Paquete: 160-LQFP |
En existencias2.544 |
|
- | 1 | 3V ~ 3.6V | 250mA | - | -40°C ~ 85°C | Surface Mount | 160-LQFP | 160-LQFP (24x24) |