Imagen |
Nº de pieza |
Fabricantes |
Descripción |
Paquete |
En existencias |
Cantidad |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
IC CTRLR INT 256CH 323-FCLBGA
|
Paquete: 323-BBGA, FCBGA |
En existencias4.544 |
|
E1, HDLC, PPP, Serial, T1, TMA | - | - | - | 2W | -40°C ~ 85°C | Surface Mount | 323-BBGA, FCBGA | 323-FCLBGA |
||
Infineon Technologies |
IC CODEC VOICE 4-CHAN LQFP-176-2
|
Paquete: 176-LQFP |
En existencias7.696 |
|
JTAG, PCM, SCI/SPI | 4 | - | - | - | -40°C ~ 85°C | Surface Mount | 176-LQFP | PG-LQFP-176 |
||
NXP |
IC C1K 450MHZ VOIP 448BGA
|
Paquete: - |
En existencias7.328 |
|
- | - | - | - | - | - | - | - | - |
||
Microsemi Corporation |
IC VCP II NGCC 72CH 144LBGA
|
Paquete: - |
En existencias31.464 |
|
- | 1 | - | - | - | - | Surface Mount | - | 144-BGA |
||
Microsemi Corporation |
IC TDM SWITCH 4K-CH ENH 256BGA
|
Paquete: 256-BGA |
En existencias5.856 |
|
- | 1 | 1.71 V ~ 1.89 V | 130mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC TDM SWITCH 2K-CH ENH 256BGA
|
Paquete: 256-BGA |
En existencias7.696 |
|
- | 1 | 1.71 V ~ 1.89 V | 120mA | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Microsemi Corporation |
IC DGTL SWITCH RCDX 144BGA
|
Paquete: 144-BGA |
En existencias2.416 |
|
- | 1 | 3 V ~ 3.6 V | 52mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA | 144-PBGA (23x23) |
||
Maxim Integrated |
IC MUX FRAMER T3 E3 256BGA
|
Paquete: 256-BGA |
En existencias2.416 |
|
Parallel/Serial | - | 3.135 V ~ 3.465 V | 150mA | - | 0°C ~ 70°C | Surface Mount | 256-BGA | 256-PBGA (27x27) |
||
Maxim Integrated |
IC DS21448 REV A1 COMM TEBGA
|
Paquete: 144-BGA |
En existencias6.976 |
|
- | 4 | 3.135 V ~ 3.465 V | 320mA | - | 0°C ~ 70°C | Surface Mount | 144-BGA | 144-TEPBGA (17x17) |
||
ams |
IC TELEPHONE CMOS MULTIFU 28SOIC
|
Paquete: 28-SOIC (0.295", 7.50mm Width) |
En existencias40.368 |
|
- | 1 | 3.8 V ~ 5 V | 4mA | - | -25°C ~ 70°C | Surface Mount | 28-SOIC (0.295", 7.50mm Width) | 28-SOIC |
||
Exar Corporation |
IC LIU T1/E1/J1 OCTAL 225BGA
|
Paquete: 225-BGA |
En existencias3.488 |
|
LIU | 8 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 225-BGA | 225-BGA (19x19) |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 8CH SHORT 208-TQFP
|
Paquete: 208-BFQFP |
En existencias5.168 |
|
LIU | - | 3.13 V ~ 3.47 V | - | - | -40°C ~ 85°C | Surface Mount | 208-BFQFP | 208-PQFP (28x28) |
||
Texas Instruments |
IC INTERFACE ISDB DEVICE 20DIP
|
Paquete: 20-DIP (0.300", 7.62mm) |
En existencias14.640 |
|
ISDN | - | 4.75 V ~ 5.25 V | - | - | - | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC C2K 1.2GHZ 16CH VOIP 625BGA
|
Paquete: - |
En existencias7.536 |
|
- | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC LIU T1/E1 8CH SHORT 144-TQFP
|
Paquete: 144-LQFP |
En existencias5.056 |
|
Parallel/Serial | - | 3.13 V ~ 3.47 V | 55mA | - | -40°C ~ 85°C | Surface Mount | 144-LQFP | 144-TQFP (20x20) |
||
Maxim Integrated |
IC TXRX T1/E1/J1 SGL 100-LQFP
|
Paquete: 100-LQFP |
En existencias15.996 |
|
E1, HDLC, J1, T1 | 1 | 3.14 V ~ 3.47 V | 75mA | - | 0°C ~ 70°C | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Microsemi Corporation |
IC TDM/TSI SWITCH 128X128 40DIP
|
Paquete: 40-DIP (0.600", 15.24mm) |
En existencias2.928 |
|
- | 1 | 4.75 V ~ 5.25 V | 6mA | - | -40°C ~ 85°C | Through Hole | 40-DIP (0.600", 15.24mm) | 40-PDIP |
||
Linear Technology |
IC RING TONE GENERATOR 14-SOIC
|
Paquete: 14-SOIC (0.154", 3.90mm Width) |
En existencias2.928 |
|
- | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Silicon Labs |
IC PROSLIC FXS ISI -106V 48QFN
|
Paquete: - |
En existencias3.280 |
|
3-Wire, PCM | 2 | 3.3V | - | - | -40°C ~ 85°C | - | - | - |
||
Silicon Labs |
IC PROSLIC PCM/SPI -140V 42QFN
|
Paquete: 42-WFQFN Exposed Pad |
En existencias6.624 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Silicon Labs |
IC PROSLIC FXS PCM -106V 56QFN
|
Paquete: - |
En existencias4.544 |
|
3-Wire, PCM | 2 | 3.3V | - | - | 0°C ~ 70°C | - | - | - |
||
Silicon Labs |
IC PROSLIC FXS DC-DC -135V 42QFN
|
Paquete: 42-WFQFN Exposed Pad |
En existencias2.864 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Microsemi Corporation |
IC SLIC 2CH UNIV 100V 40QFN
|
Paquete: - |
En existencias3.248 |
|
Serial | 2 | 3.3V | - | - | - | Surface Mount | - | 40-QFN |
||
Maxim Integrated |
IC MICRODAA PCM HWY 20TSSOP
|
Paquete: 20-TSSOP (0.173", 4.40mm Width) |
En existencias4.848 |
|
PCM | 1 | 3 V ~ 3.6 V | - | - | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microsemi Corporation |
IC SLIC 1CH UNIV 100V 40QFN
|
Paquete: - |
En existencias6.080 |
|
Serial | 1 | 3.3V | - | - | - | Surface Mount | - | 40-QFN |
||
NXP |
DUAL HDMI 1.4B RX
|
Paquete: - |
En existencias5.616 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN
|
Paquete: 48-VFQFN Exposed Pad |
En existencias4.768 |
|
RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |
||
Microchip Technology |
4P 10G WAN/LAN XFI-SFI MACSEC+15
|
Paquete: 256-BBGA |
En existencias4.032 |
|
SPI | 4 | 970mV, 1.2V | - | - | - | Surface Mount | 256-BBGA | 256-FCBGA (17x17) |
||
Silicon Labs |
IC ISOMODEM SYSTEM-SIDE 24TSSOP
|
Paquete: 16-SOIC (0.154", 3.90mm Width) |
En existencias29.940 |
|
Parallel, SPI, UART | 1 | 3 V ~ 3.6 V | 15mA | - | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Broadcom Limited |
SWITCH FABRIC
|
Paquete: - |
En existencias6.720 |
|
- | - | - | - | - | - | - | - | - |