Microchip’s RN2483 433/868MHz LoRa Module integrates a modem with a range of more than 15km (suburban) and offers low-power that enables a battery life greater than ten years.
Designed for directional lamps and spotlights, Lumileds’ Luxeon family of chip-on-board (CoB) white LEDs is available in a range of different colour temperatures, the LEDs are ideal for use in the home, hospitality and retail environments.
Microchip’s new dsPIC33EP GS Series digital signal controllers (DSCs) enable power supply designs that are more energy efficient and have superior specifications. They feature higher switching frequencies, which enable the development of physically smaller power supplies that offer higher densities and lower costs.
Freescale’s HVP high-voltage development platforms are offers development solutions for the company’s KInetis V series MCUs and digital signal controllers (DSCs).
Texas Instruments (TI) has unveiled a series of advanced tools in WEBENCH Power Designer that provide experienced engineers extensive design control, analysis and trouble-shooting capability to create complex power-supply designs.
Microchip has introduced two new 8-bit families that expand its growing portfolio of innovative PIC MCUs with Core-Independent Peripherals (CIPs). The 8-bit MCUs can now be used in a much broader range of applications, due to the growing number of these intelligent, interconnected CIPs that combine to perform functions autonomously, without the core.
Kemet has announced the expansion of its high-voltage Goldmax radial-leaded multilayer ceramic capacitor (MLCC) product line to include a new 630VDC rating as well as leading capacitance values.
Atmel’s SAM C21 Xplained Pro Evaluation Kit, a low-cost hardware platform for evaluating the Atmel ATSAMC21J18A microcontroller. Supported by the Atmel Studio integrated development platform, the kit provides easy access to the features of the ATSAMC21J18A and explains how to integrate the device into a custom design.
Latest from Renesas are two new series of Advanced Low Power SRAM (Advanced LP SRAM), the leading type of low-power-consumption SRAM, designed to provide enhanced reliability and longer backup battery life for applications such as factory automation (FA), industrial equipment, and the smart grid.
TE Connectivity’s stacked QSFP+ connector and cage assemblies. Offering superior signal integrity surpassing competitive solutions by up to 8dB (at 5GHz), the Quad Small Form-factor Pluggable (QSFP+) stacked cage assemblies provide four channels of data in one pluggable interface.
Texas Instruments (TI) has introduced a pair of 32-bit delta-sigma analog-to-digital converters (ADCs) that combine high resolution, low noise and integrated fault detection, eliminating many of the performance and features trade-offs typically associated with device evaluation and selection.
Harwin’s surface-mount test points are fully auto-placeable to PCBs, minimizing installation costs.
Cost-effectively providing angle monitoring in harsh transportation and industrial applications, Honeywell’s RTY Series Hall-effect rotary position sensors.
The ON Semiconductor NCL30030 PWM controller. The device integrates power factor correction (PFC) and quasi-resonant fly-back controllers to ensure a compact and highly-efficient A/-DC LED driver for high-performance, low-ripple LED lighting applications.
Vishay is broadening its optoelectronics portfolio with the introduction of two new SurfLight high-speed infrared (IR) emitting diodes in compact 3.2mm by 1.6mm by 1.1mm surface-mount, top-view packages.
Additions to its GRM Series of 1206 and 1210 size monolithic ceramic capacitors (MLCCs), above 100uF, have been announced by Murata.
The STMicroelectronics I3G4250D three-axis digital output gyroscope, a low-power angular rate sensor able to provide unprecedented stability at zero-rate level and sensitivity over temperature and time.
Aimed at Power over Ethernet (PoE) applications, CUI has announced the expansion of its 3000W front-end AC/DC power supply series with the addition of the PSE-3000-54.
